Hamamatsu C7103 Back Side Polishing System

Description:PC Controlled IC Back-side Lapping and Wafer Grinding System

Version:200 mm and packages

Vintage:2001

Quantity:1

Sales Condition:as is where is

The C7103 is a computerised IC backside polishing system for use when preparing a

sample for backside emission analysis or any other analysis technique that requires visualization of the chip internally.

Ce marked.

Main Specifications

Operating Range

X-axis: 250 mm (9-13/16 inch)

Y-axis: 150 mm (5-7/8 inch)

Z-axis: 150 mm (5-7/8 inch)

Resolution

0.01 mm/step (X Y Z)

Interface

Parallel (Centronics)

Operating Temperature

5 to 40°C

Operating Humidity

20 % to 75 %

Weight and dimensions:

Weight 150 KG Dims: 134 cm x 134 cm x 75 cm (On wooden base)

Consists of:-

-Main Unit

-8 inch vacuum chuck

-IC Wax holder

-PC (HP Vectra with Windows NT 4.0)

-Hamamatsu s/w V 1.30

-Mouse, Kbd, Monitor

-Power transformer for 240V 1 phase power input

-Power supply unit

-Operation and Maint. manual V1.30

-Control paddle