2009 Hesse & Knipps Bondjet BJ820 Wire Bonder

2009 Hesse & Knipps Bondjet BJ820 Wire Bonder

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Description

HESSE & KNIPS, PIEZO BONDJET BJ820 WIRE BONDER


DESCRIPTION

Includes Hesse DA 04 051 Deep Access Bondhead & Light Tower; Number of Bonds Approx 37,054,610; Dimensions of Machine Approx 720mm x 1300mm x 1800mm High;


Specs:



  • Fully Operational 4 Axis Rotary Bondhead Wedge-Wedge Bonder with Standard X & Y axis Table,
  • Working Area 305mm x 410mm;
  • Bonding is possible inside the following working area: X Axis:305mm, Y Axis: 410mm, Z Axis: 30mm, P Axis (rotational axis): 420 Degrees;
  • Axis Repeatability 1 Micorn @ 3 Sigma;
  • 2" Wire Spool Motorized Wire Feeder;
  • Wire Dia Range 17.5 Micron - 60 Micron;
  • Lost Wire & Wire Consumption Detection System;
  • (4) Linear Motors & (1) Rotational Synchron-Servo Motor;
  • Mini CCD Camera;
  • Bondjet Pattern Recognition System;
  • Leica MS5 Microscope;
  • Keyboard & Trackball;
  • Trivac D8B Pump & Motor;
  • Serial number of machine: BJ820-198-0309.




Specifications

ManufacturerHesse & Knipps
ModelBondjet BJ820 Wire Bonder
Year2009
ConditionUsed
Serial NumberBJ820-198-0309
Stock NumberTARA-119