ASM AD211 Automatic Direct Eutectic Die Attach System

Features

• Accuracy ± 10 µm @ 3s
• Direct ceramic substrate handling
• Patented process and modules design
• Individually controlled pick and bond system
• Graphical SPC data with IQC system
• Anti-thermal shock design for eutectic process
• Gas supply formed during the process
• Material traceability capability
• Optional flip chip capability

Dimensions

W x D x H, 2,080 x 1,270 x 2,080 mm³