Hesse & Knipps/ Hesse Mechatronics Bondjet 810

Wedge Bonder

Bonder

Equipment details:

Date of Manufacture:

Currently Configured for: N/A

Current Equipment Status: Available

Available date: Currently Available

Audit to verify

====================== OEM Feature for reference ======================

Automatic wedge-wedge wire bonder

Wire diameters: 17.5 μm - 60 μm

Piezo bond head 89° for BJ820

Heating table

Deep access

E-Box