Fogale Nanotech Deeprobe 300-M

Condition: “As is” 
Date of manufacture: 2014

​Wafer size 200-300mm

Vintage +/- 2014

Technology

Low Conherence IR interferometry for step high

measurement

Applications

High A/R TSV depth measurement for 200 and

300mm wafer (Via first & Middle)

Benefits

Non destructieve Technology

Fast and easy to use

CCD camera for spot positioning and pattern

recognition

Adjustable Metrology spot size

TSV diameter > 2um A:R up to 30

Calibration and maintenance free