Dynatex DX III

Description Wafer Scriber/Breaker

Other Information For Scribing & Breaking of up to 4” Wafers

Chip Free™ Breaking Mechanism Uses Impact Breaking System

Minimum Die Size: 0.005” Square (125µ)

Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ)

CCD Camera Alignment System

Internal PC Control System Incomplete - No HDD

Facilities Required:

Input Voltage: 115VAC, 60Hz, 5A

CDA or N2: 60-85 PSIG, 0.5 CFM

Vacuum: 15-28 In. Hg, 0.5 CFM