Applied Materials Verasem 3D

APPLIED MATERIALS (AMAT) VERASEM 3D AUTOMATED CD METROLOGY SYSTEM Wafer Specification o Wafer Size: 200MM o Wafer Shape: SNNF (Semi Notch No Flat) o Wafer : 6”, 8” or 12” Electron Optical System o Electron Gun Schottky emission source (fei) o Accelerating voltage 300V to 2000V o Probe Current Low 5pA / Medium 10pA / High 20pA o Electromagnetic Lens 3 Stage Electromagnetic Lens o System with boosting voltage Beam Deflector Module Objective Lens o Scan Coil 2-Stage Electromagnetic Deflection (X- and Y-Axes) o Magnification 1,000x to 400,000x (100um to 0.25um FOV) o Wafer imaging ability Entire surface of 8” wafer o Asspect Ratio >14 : 1 o Tilt Function 5 degrees (4 Direction) o Resolution 3nm (500V) SECS/GEM Communication Interface o Automated Image Archiving Function Always / Online Setup / Never o Measurement Function Average/Maximum/Minimum/Contact Hole/ o Line Edge Analysis/CH Analysis/Slope o Measurement Algorithm Normal / Foot / Threshold