KLA Tencor Flexus 2908

KLA Tencor Flexus 2908 Wafer size: 125mm-200mm Temperatures up to 900C Dual wavelength technology MS Windows based software Power: 230v, 50/60hz Tool primarily used for calculation of biaxial modulus of elasticity and linear expansion, water diffusion coefficient in dielectric films, linear regression and stress-temp or stress-time gradients.