2010 ISIS Sentronics GmbH SemDex 301-12

Silicon non-contact thickness measurement

Technical specifications: 

Sensor system with a StraOex f 300 - 24:

- Wavelength: 1300 nm

- Spot size: 20 µm

- Autofocus range: 24 - 44 mm

- Max. acquisition rate (fast mode): 4 KHz

- Absolute accuracy: < +/- 0.3 µm (1 sigma)

- Repeataibility: < +/- 0.1 µm (1 sigma}

- Maximum surface roughness (Rz): 1 µm

Fast acquisition mode (kHz rate): 1 O - 350 µm {Silicon) Slow acquisition mode (few Hz rate): 1 O - 1000 µm {Silicon) 

Stage: 

- Max.x/y travel range: 300 x 300 mm"2

- Max. velocity: 50 mm/s

- Lateral accuracy: 4 µm

- Max. height variation: 2 µm

- Free positioning via trackball

Vacuum chuck for single side measurements:

- 6", 8" and 12" unframed wafers

- 6", 8" and 12" framed wafers

- any size broken piece

- 1 bar airpressure generated

WaferSpect Software:

Operating wizard: 

- Position control (point, line, 20 area), freely programmable

- Automatic saving of data

- Export into ASCII files, also in table format

- List of known refractive indices for some substrate materias. Addi can be added.I

- Visualizing of the data in 10, 20 or 3D representation

- Verification of the absolute accuracy and repeatibility

General:

- Manual loading of object and automated measurements

- Monitor and keyboard (with trackball) integrated into front panel