2006 Powatec L-300 backgrinding Taper

Manual 300mm Laminator

It was used for mounting wafer onto frames. 

It has a winding unit for liner tape 

Including Ionizer

The Powatec L-300 is a manual table-top device used in semiconductor and cleanroom applications to apply back-grinding protective tape to wafers up to 300 mm in diameter. It provides a bubble-free lamination to protect the wafer's processed surface during subsequent back-grinding processes