EVG820 Dry Film Lamination System

EVG820 Dry Film Lamination System

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Description

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.


In good condition.

Specifications

ManufacturerEVG820 Dry Film Lamination System
ConditionUsed
Stock Numberem426
WAFER SIZEMin 200 mm Max 300 mm