2015 Applied Materials Centura AP AdvantEdge G5 Mesa T2 Poly

Applied Materials Centura AP AdvantEdge G5 Mesa Poly Polysilicon Etch

EQUIPMENT DETAILS:

1. Centura AP Mainframe Application

 Qty 3 – DPS Advantage Mesa T2 Conductor Etch Chambers

 Qty 1 – Axiom HT Strip Chamber

1. Application

1. Etch Centura AP 3 D10 and I AXP Application Package

2. W Gate Application

3. Post Etch Application

2. SILICON AXIOM HT CHAMBER

1. CCM Cover

2. Ch AC Cover

3. CUSTOMER FAB OPTIONS

1. Fast eDiagnostic Sys Interface

2. Fast Data Gateway

3. Hynix Package

4. GAS PANEL OPTIONS - CL2 Purifier

5. MAINFRAME OPTIONS - Corrosioesistant FI and SWLL

6. FACTORY INTERFACE OPTIONS

1. Side Storage Pod

2. 3 Load Ports

3. Interface A Option

4. Infopad Pos A or B

5. Operator Access Switch

6. Front Facing Intake Plenum