EVG 501 Wafer Bonder

150mm

As-is or refurb

- Model:  EVG 501

- Capable of thermo compression, fusion or anodic wafer bonding

- Bond chamber for small pieces up to 150mm wafers (with correct tooling)

- Thickness: Max wafer stack thickness 6mm

- Bottom side heater: 550°C max. in 1°C steps

- Temperature uniformity: ± 1,5 %

- Turbo Pump

- High voltage power supply for anodic bonding (additional tooling may be required)

- Electronics Rack

- Computer & Software

- LCD Monitor

- Roughing Pump

- Operations Manual for EVG 501 Bonder

- Available for full inspection and demonstration

- Installation, training, service, and support available worldwide for all our refurbished EVG Bonders!