2006 Applied Materials Endura II Liner/Barrier

Applied Materials Endura II Liner/Barrier PVD (Physical Vapor Deposition)

Currently Configured for 300mm wafer size

MFG Date: January, 2006

EQUIPMENT DETAILS:

Tool is operating in clean room.

‘Equipment is located in cleanroom and is schedule for deinstallation by [VENDOR

NAME]. Buyer is responsible for $X,XXX.XX in de-installation costs payable to . Buyer is

also responsible for packaging, crating, loading and shipping’

A HARD DISK DRIVE WILL BE REMOVED FROM TOOL.

[Chamber 2]

For Ti PVD chamber

DCPS;OPTIMA DCG-200,ENI,for PVD

PUMP/CRYO,OBIS,HELIX

HT ESC type stage

Ar;150/20sccm

[Chamber 3]

For TiN PVD chamber

DCPS;OPTIMA DCG-200,ENI,for PVD

PUMP/CRYO,OBIS,HELIX

A101 type stage

Ar/N2;150/200sccm

[Chamber 4]

For TiN PVD chamber