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2006 Applied Materials Endura II Liner/Barrier
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Applied Materials Endura II Liner/Barrier PVD (Physical Vapor Deposition) Currently Configured f...
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S.E.S. CO., LTD. BW3000X
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BW3000X S.E.S. CO., LTD. Batch Wafer Processing Etch/Clean - Wet Processing
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2004 Ebara FREX300S
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Ebara FREX300S Dielectric CMP Currently Configured for 300mm Wafer Size MFG Date: 2004 EQUIPME...
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2010 Applied Materials Centura ACP DPN Gate Stack
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Applied Materials Centura ACP DPN Gate Stack Decoupled Plasma Nitride Currently Configured for ...
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2012 ASM International Eagle XP EmerALD
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ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition) Currently Configured for 300mm...
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2007 Tokyo Electron Ltd. Trias Ti/TiN
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Tokyo Electron Ltd. Trias Ti/TiN Metal CVD (Chemical Vapor Deposition) Currently Configured for ...
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2015 Applied Materials Producer GT SiCoNi Clean
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Applied Materials Producer GT SiCoNi Clean PECVD (Chemical Vapor Deposition) Currently Configure...
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2010 Novellus Systems Inc. VECTOR Express
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Novellus Systems Inc. VECTOR Express PECVD (Chemical Vapor Deposition) Currently Configured for...
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2005 Applied Materials Centura AP Ultima X
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Applied Materials Centura AP Ultima X HDP CVD (Chemical Vapor Deposition) Currently Configured f...
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2013 Tokyo Electron Ltd. TELINDY Plus IRAD Oxide
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Tokyo Electron Ltd. TELINDY Plus IRAD Oxide Vertical LPCVD Furnace Currently Configured for 300m...
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Tokyo Electron Ltd. Trias Ti/TiN Chamber
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Tokyo Electron Ltd. Trias Ti/TiN Chamber Parts/Peripherals Currently Configured for 300mm wafer ...
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Aviza Technology, Inc. RVP-300
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Aviza Technology, Inc. RVP-300 Vertical Diffusion Furnace Currently Configured for 300mm wafer ...
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