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2012 ASM International Eagle XP EmerALD
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ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition) Currently Configured for 300mm...
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Tokyo Electron Ltd. Trias Ti/TiN Chamber
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Tokyo Electron Ltd. Trias Ti/TiN Chamber Parts/Peripherals Currently Configured for 300mm wafer ...
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2013 Tokyo Electron Ltd. TELINDY Plus IRAD Oxide
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Tokyo Electron Ltd. TELINDY Plus IRAD Oxide Vertical LPCVD Furnace Currently Configured for 300m...
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Aviza Technology, Inc. RVP-300
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Aviza Technology, Inc. RVP-300 Vertical Diffusion Furnace Currently Configured for 300mm wafer ...
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2015 Justin BD&L SC-W80A-AVF SOG Integrated System
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Justin BD&L SC-W80A-AVF SOG Integrated System. SOG Coat and Vertical Furnace System Wafer size ...
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Zhengzhou Brother Furnace Co. BR-14A-27 Inert Atmosphere Furnace
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This Zhengzhou Brother Furnace Co. BR-14A-27 Inert Atmosphere Furnace appears to be in good cosme...
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S.E.S. CO., LTD. BW3000X
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BW3000X S.E.S. CO., LTD. Batch Wafer Processing Etch/Clean - Wet Processing
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2006 Applied Materials Endura II Liner/Barrier
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Applied Materials Endura II Liner/Barrier PVD (Physical Vapor Deposition) Currently Configured f...
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Tokyo Electron Ltd. TELFORMULA Anneal
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TELFORMULA Anneal Tokyo Electron Ltd. Vertical Anneal Furnace Furnaces/Diffusion Systems
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Kaijo Corporation SFT-300
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SFT-300 Kaijo Corporation Batch Wafer Processing Etch/Clean - Wet Processing
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