Gasonics 9104 plasma asher (never installed with new control box)

Features and Specifications

Gasonics/IPC 9104 Ash/Etch system

12"(dia) x 20"(D) quartz barrel

soft pumping and purge valving

low particulate design

2ea mass flow gas inputs with VCR fittings

all SS plumbing,

multi channel/single board computer controlled, with floppy storage

temperature monitor

ENI OEM 12B 1250W RF Generator

• Wafer Size: 4", 6", 8" capability
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• Capacity: 50 8" wafers, 50-75 6" wafers, 100 4" wafers. 
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• Chamber: Quartz, compatible with fluorinated chemistry. 12" diameter x 20" deep. External RF electrodes.
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• RF Generator: 1250 watt 13.56 MHz air cooled with automatic impedance matching network. Water cooled optional.
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• Process Pressure: Approx. 120 - 2000 mtorr.
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• Stainless Steel Plumbing.
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• Temperature Monitor: Quartz-coated thermocouple located in the process chamber.
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• Display: Color 12.1" touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments.
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• Four user specified gases, with 500 sccm Stainless Steel MFCs come standard with an optional 3rd and/or 4th gas channel available.
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• Power Requirements: 208 - 240 volts, 3ø, 50/60 Hz 5 wire "wye".
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• A NEMA-12 wall mounting enclosure with locking handle contains the AC power control for the asher, power supply, and pump, allows for a single source drop for the complete system.
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• CE Certified.