KLA SP2.5Plus W.YLD3

BARE WAFER INSPECTION 300mm

HDD will not be included,

·      Defect Inspection

·      Two Load Ports

·      SECS/GEM Capability

·      Integration to Klarity/UDB

·      Auto DSA

·      High resolution 3D imaging of wafer surface

·      CE Mark Compliance

·      UV Laser: 350mW @ 355nm

·      Hi-speed handler

·      Low K inspection capability

·      3 Inspection Modes

·      SURFimage, 192 grey-scale

·      XY coordinate accuracy: 28um

·      PSL/ SEMI M50

·      Data Processing: D3P3, 2D algos

·      ASD Handler, dual wrist robot

·      Vacuum Handler: 90-45nm nodes

·      Illumination Optics: Normal + Oblique, 3 spots, reversed beam direction

·      Collection Optics: Ellipsoidal + Narrow, 6 Spatial Aperture Slots

·      Software: NGS 5.X, Windows XP