2022 BESI Datacon 2200 evo plus
2022 BESI Datacon 2200 evo plus
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Description
- Die Attach, Flip Chip & Multi-Chip Capability
- Upgraded Camera & Image Processing
- Large Format Heated Stage
- Thermal Compensation
- Never Used for Production
- Open Platform Architecture
Condition Like New
Year of Manufacture 2022
CE Marked YES
Specifications
| Manufacturer | BESI Datacon |
| Model | 2200 evo plus |
| Year | 2022 |
| Condition | Used |
| Stock Number | BM5061 |