2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy
2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy
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Description
Includes:
FINEPLACER lambda
Bonding force module FD3
Chip heating module
Optional Dispensing Module FG3
WinFlipChip software version 3.2 Revision 052 and PC
manufacture date 2017
Specifications
| Manufacturer | Finetech |
| Model | FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy |
| Year | 2017 |
| Condition | Used |
| Stock Number | BM5065 |