AMAT P-5000 Mark II MxP+ Poly

Polysilicon Etch

Etch/Ash/Clean - Plasma Processing

Currently Configured for: 200mm

Current Equipment Status: Available

Available date: Currently Available

Software: 4.8_26

MF: P5000 Mark II

Qty 4 - MxP+ Poly

ESC: Polymide

Gases Used: N2, CF4, AR, O2, CHF3, CO, C4F8

MFCs: 28 DIgital MFC's Unit or Horiba

Robot: ROBOT ASSY 8 IN AMAT 5000

Dry Pumps:

1-BA100, 2 DS80/250, 2-IQDP80/WSU151

Chillers:

2 Neslab 150