1995 CDE CDE80/3 Plasma Etch

The system was in production until February 2025.

Wafer Size Range   Minimum 150 mm  Maximum 150 mm  Set Size 150 mmOther Information process gases CF4; O2; N2

Condition Good

Year of Manufacture 1995

Power Requirements 200-208 V   75.0 A   50 Hz   3 Phase