2002 Applied Microengineering Ltd (AML) AWB08

Wafer Bonder

Wafer Level Packaging

Date of Manufacture: 2002-12-31

Currently Configured for: 200mm

Audit to verify The AWB has the versatility to perform aligned Anodic, Eutectic, Direct (High & Low Temperature) Glass frit, Adhesive, Solder & Thermo-compression wafer bonding. Alignment & bonding in one machine - Wafer size 8" - 8" standard IR platens for forces up to 15kN - IR and vis alignment - Twin Microscope ? camera system with throughthe-lens illumination. Two CCD cameras and side-by-side display of images. Including IR capability. - In-situ alignment up to 1 micron accuracy - 10-6mbar Vacuum to 2bar process gas - forced nitrogen cooling - Voltage up to 2.5kV - Temperature up to 560° C - Semi-automatic PC control & data acquisition Dimensions / Weight (approx. values) 1066 / 745 / 1380 350 kg Included: Pump: Pfeifer MVP 070-3 (defective) ==================== OEM Feature for reference ==================