2023 BENEQ TFS 200

Brand new BENEQ TFS 200 ALD system

The tool is still in the original OEM crates and was never opened or installed. It’s a dual-chamber set-up that was purchased two years ago, but due to a shift in production plans, it was never put into use.

· 200mm capable

· 2023 vintage

· Still crated, never installed

· Dual chambers (plasma or thermal process)

· Precursors: 2 thermal, 4 liquid

· Includes Hine autoloader (can be configured for manual batch process)

· Includes all support equipment

Wafer Sizes:

8"/200mm

Operational Status:

Deinstalled / Crated

It is configured with two chambers, could be set up as one chamber. Either chamber would run plasma or thermal process. The system is for 200mm wafers with a Hine autoloader, but could handle a manual batch process.

Configuration

BENEQ TFS 200 Dual Chamber System

Configured:

Precursors plumbed for 2 thermal, 4 liquid

TFS 200-338 Tool chamber and cables

TFS 200-339 Tool chamber and cables

+A2 Electrical cabinet for TFS200-338

+A2 Electrical cabinet for TFS200-339

Hine HA200 autoloader with load lock and aligner

Liquid source bubbler single line 200ml

Rack cabinet

RF Generator

Beckhoff panel pole PC

Plasma head

Holder lifter

Substrate lifter

Plastic hatch

Reaction chamber ALU

HS300 Tank

Liquid source bubbler single line 200ml

Liquid source bubbler double line 200ml

Liquid source bottle for H2O

Documents

Panel pole PC stand

Chiller

TransformerOEM Model Description

Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements.

Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features.

Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down