2000 Evatec Clusterline CLN200

The Clusterline 200 systems offeredis equipped with 5 single process chambers each. They were used only for reactive sputtering of SiO2 layers on 150mm blank Si wafers. Both systems are still in a clean room and in working conditions. Further devices mounted on these tools are: two vacuum loadports each, wafer aligners, buffer stations for upto 5 wafers, OCR back side readers.

Handler Type MX800.

5x Pulsed DC chambers with RF on Chuck

Configured for 150mm Running in Production.