TEL Tactras RLSA Poly
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Description
5 available
300mm
Multi Block (Resist Coater/Developer)
Resist Processing Equipment
· Utilized with Nikon S610i
· General
· iUSC SECSI, SECSII, HSMS, & GEM Interface Compatibility
· (5) Blocks Interfaced: Cassette Block, (2) Process Blocks, Scanner Interface (Main and Sub)
· (5) Wafer Transfer Robot Arms: Cassette, (2) Process, Scanner Interface (Main and Sub)
· Cassette Block
· (4) FOUP Loadports
· RFID capability
· Pressure sensor
· Process Block
· (3) Coater (COT) modules
· (4) 1.2mm resist nozzles with temperature control per coater
· 4L or 1L Nowpak bottle insert
· Exhaust pressure controller (EPC) per coater
· (2) Immersion Top Coater (ITC) modules
· (2) 1.2mm resist nozzles with temperature control per coater
· (5) Developer (DEV) modules
· (2) NLD nozzles with temperature control per developer
· SRN rev2 nozzle with main and sub nozzles
· Phase 0 pre-plumbing for future FIRM field retrofit option
· Pre-plumbing (N2 line only) for future PDR field retrofit option
· (4) Adhesion (ADH) modules
· (9) Chill Plate (CPL) modules (optical wafer wedging enabled)
· (1) Transfer Chill Plate (WCPL) module
· (5) Transfer Low Temperature Hot Plate (CLHP) modules
· Pre-plumbed for future CPHG field retrofit option
· Wafer wedging detection via plate temperature sensors
· (9) Precision Chilling Hot Plate (CPHG) modules for soft bake or post-exposure bake
· Wafer wedging detection via plate temperature sensors
· 0.1mm gap pin (type PEEK) proximity pins on chilling arm
· (1) WEE module (pre-plumbed only)
· Interface Block
· IRAS i dual-pincette wafer handling robot
· (2) Post Immersion Rinse (PIR) modules
· Buffer cassette; 4-6, 7 for wafer capability
· (2) Interface Chilling Plates (ICPL)
· Subcomponents
· TEL Temperature & Humidity Controller
· (2) Chemical Cabinets
· AC Power Box
Specifications
| Manufacturer | TEL |
| Model | Tactras RLSA Poly |
| Condition | Used |
| Stock Number | BM5467 |
