2016 Royce Instruments Autoplacer MP300 for wafers up to 200mm

Royce Instruments MP300 Autoplacer

Manufacture Date 2016

Maximum 200mm wafer (motorized xy stage has 8x8 travel)

includes 3 die pickup assemblies

All manuals and software included

Specifications:

Electronic wafer map

Up to 16 x 2 inches (50mm) waffle pack or Gel-Paks

Quad needle eject head, up to 3 mm eject height

Die size from approx. 0.76 “ 25.6 mm square

Standard soft surface contact vacuum pick up

Non surface contact mechanized die pick and place system

Microscan DOAL® (Diffuse On-Axis Light) illuminator provides diffuse, uniform illumination for flat specular surfaces. With the coaxial lighting approach, specular surfaces perpendicular to the camera appear bright, while surfaces surfaces which are marked or embossed absorb light and appear dark. By providing greater uniformity than conventional sources, DOALs increase machine vision accuracy and repeatability.

Smart Series Technology: Built-in controller with continuous and high output strobe modes

• Provides superior uniformity throughout the illumination envelope
• Passively cooled 
• The ability to process die using either wafer maps or ink dot recognition.
• The Die Sort Manager has an extensive library and can accommodate the latest software formats as well as the many older/legacy wafer map formats.
• The quick change flexibility makes it ideal for volumes from a few prototype wafers to high volume production.
• Micron level control of the die ejection enables the handling of die as thin as 50 microns without damage.
• Die pick-up and handling include the conventional vacuum pick-up and also a unique non active surface handling technology which allows the sorting and placement of fragile die such as GaAs die with air bridges, MEMS, microfluidics, Lab-on-Chip, biochips, optoelectronics and inkjet heads.
• Allows transition from one wafer size to another whether larger or smaller, or to a completely different format to allow full utilization of downstream equipment and processes. This is particularly
• important when picking die from multi-project wafers, the so called “Pizza Wafers.”
• Customer or device specific parameters are easily stored and maintained to allow easy recall and
• implementation of proven programs at a later date to ensure the reliable and repeatable processing of all die.
• The fully automated process will sort and bin entire wafers without operator input allowing 100%
• die traceability.
• For MEMS type devices where the die surface cannot be touched the MP300 utilizes a custom gripper which can pick up the die from the sides and whose force is fully adjustable between 0 to 20 grams.