2010 MVP 850G

PCB - Test and rework machines

Length x width x height 844.0 × 1066.0 × 1473.0

Weight680 kg

State good

At local norms yes

Status under power

Description

The machine was purchased at auction without software, but everything else is on the machine and working.

MVP’s 850G inspection techniques include high-resolution telecentric imaging, quad color lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Die and Wire Bond inspection. For in-line operations, single and dual lane options are also available to quickly process microelectronic assemblies.

MVP also provide many material handling configurations for the 850G AOI system including magazine lifters, tray handling and other custom solutions. For in-line operations, single and dual lane options are also available to quickly process microelectronic assemblies.