Tepla 300 AL-PC Plasma Asher

- Model: 300 PC Main System

- Manual wafer load plasma asher

- Designed for Wafer Cleaning and Descum

- Plasma Chamber: Quartz

- Plasma Chamber Dims: 245mm diameter, 380mm depth

- Plasma Generation: 2.45 GHz Max / 1.000 Watt Variable

- Gas Lines: N2 Gas Input and 2 Process Gas Inputs

- Motor Driven Drawer Unit

- Vacuum Pump

- Computer PC controlled

- Operators Manual for Tepla 300.