Canon Machinery BESTEM D531T

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Description

  • Wafer Size: 300
  • Group: Electronic
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder


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Specifications

ManufacturerCanon Machinery
ModelBESTEM D531T
ConditionUsed
Stock NumberGOD23082023720223562