Disco DFL7160

Contact us for price

or
Call +353 (0) 87 192 1110

Description

  • Wafer Size: 300
  • Group: Electronic
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Laser Dicing Saw


Show All

Specifications

ManufacturerDisco
ModelDFL7160
ConditionUsed
Stock NumberGOD23082023720223564