HITACHI S-7800HSA SEM

Specifications

Specification Unit DFP8140

Supported workpiece size - Φ4/5/6/8 inch(Select one size)

Polishing Method - Anomalous In-feed grinding with wafer rotation

Wheel - Φ300 mm Dry Polishing Wheel

Chuck table type - Porous chuck table

Chuck-method - Vacuum

Number of revolutions min‐1 0 ～ 300

Chuck table cleaning - Water & air thrust up, Leveling stone and brush cleaning

Spindle Rated output kW 4.8

Rotation speed range min‐1 1,000 ～ 4,000

Internal load sensor - Thin force sensor

Spinner unit - Wafer washing and drying by atomizing nozzle

Equipment dimensions (W×D×H) mm 1,200 × 2,670 × 1,800

Equipment weight kg Approx.1,900