Applied Materials AMAT P-5000 Mark II MxP Poly

Polysilicon Etch

Etch/Ash/Clean - Plasma Processing

Currently Configured for: 200mm

Software: 4.8_26

MF: P5000 Mark II

Qty 2 - MxP Poly

Qty 2 - MxP (missing many parts)

ESC: Polymide

Gases Used: HE, CHF3, O2, AR, CF4, CH3F, SF6, CF4, HBR,CL2,HE/O2,N2

MFCs: 31 DIgital MFC's Unit and Horiba

Robot: ROBOT ASSY 8 IN AMAT 5000

Dry Pumps:

1-BA100,

3-IQDP80/WSU151

1-LYBOLD100/WSU151

Chillers:

2 Neslab 150, 1- Hx AMAT 0

Known Damaged/Missing Parts:

2 ch's not avail for use due to missing parts - noted above