2022 KLA ASET-F5x UV Film Thickness Tool

KLA-TENCOR ASET-F5x Thin Film Measurement System

• Manufactured in June, 2002
• Inspection Modes Include:
• Dual Beam Spectrometry
• Spectroscopic Ellipsometry
• Film Stress Analysis
• SUMMIT™ Application Software Version 3.21.16
• FTML Version 3.46.06
• Model 300DFF1P Wafer Loading Platform
• Dual Loadports for 300mm Wafers
• Three Axis Wafer Handling Robot
• GEM / SECS Communication
• Inquire for Additional Details

Description Thin Film Measurement System

Wafer Size Range   Minimum 200 mm  Maximum 300 mm  Set Size 300 mm

Illumination Source Type Multi-wavelength Source

Multi-Layer Film Capacity YES

Micro Spot Optics YES

Scanning Stage YES

Wafer Mapping YES

Software Revision Level SUMMIT 3.21.16

Condition Excellent

Year of Manufacture 2002

Refurbished YES

CE Marked YES