1993 Axcelis Technologies Inc. / Eaton GSD/200E

Axcelis GSD200E High Current Ion Implanter – Configuration Summary

• Manufacture Date: August 1993
• Wafer Size Capability: 150 mm (6 inch)
• Current Location Status: Installed in fab, disconnected; not decontaminated or deinstalled
• Data Verification Date: 5 Aug 2025

System Overview

• Model Type: High Current – GSD-100 platform
• Energy Range: 160 keV
• Software Version: 6.12.4
• Autotune / Beam Setup: Eaton Autotune enabled
• System Status: Offline since 2022
• CE Mark: No
• OEM Audit Record: Available
• Operational Condition (as-is): Not capable of wafer production
• Last Preventive Maintenance: 2022
• Wafer Handling: Open cassette; 4-cassette capable
• Alignment: Manual; no auto flat/notch align
• Drive Type: Direct rotary drive
• Implant Angle Control: Fixed; no dual-axis (±11°)
• Process Disk: NV-GSD200 Series with active cooling & chiller
• Beamline Extraction: Single-stage (80 keV) with post-accel electrode (80–160 kV)
• Ion Source: ELS type, molybdenum, dual vaporizer
• Mass Analysis Magnet: Single (not triple-indexed)
• Real-Time Dose / Beam Profiler: Not equipped
• Electron Shower: Present (gas bleed & closed-loop control)
• UPS Installed: No
• Facility Interfaces: Ar / N₂ / None
• GEM/SECS: Enabled (no SECS II)

Vacuum & Cooling

• Source (P1): Edwards STP-H2000C (Turbo)
• Beam Line (P3): CTI On-Board 10 (Cryo)
• End Station (P2): CTI On-Board 8 (Cryo)
• Cryo Compressor: CTI 9600 ×1 (Remote)
• Remote Disk Chiller: SMC HRS050-VUF-20 (Active cooling)

Gas Configuration (as-configured)

• Ar: MKS 1640A, 5 sccm
• BF₃: UFC-150A, 5 sccm
• AsH₃: MKS 1640A, 5 sccm (SDS)
• PH₃: MKS 1640A, 5 sccm (SDS)

Documentation & Accessories

• Standard manuals: Yes
• Cleanroom manuals: No
• Fab starter kit: No
• Fast maintenance kit: No
• All system cables: Present