2015 Meyer Burger AK 800 RIE System

Meyer Burger AK800 Configuration overview

 • Versatile ICP etcher to anisotropically etch most thin-film materials  

 • Two 5 kW 2.45 GHz microwave power supplies coupled to 4 independent waveguides deliver high-density free radicals for a gentle chemical etch  

 • 13.56 MHz power supply powers the cathode to provide bias for anisotropy  

 • Manual load (3) 6-inch wafers onto the carrier, then into L/L  

 • L/L & process chamber equipped with roughing pump and turbo  

 • Process gases BCl₃, Cl₂, CF₄, SF₆, C₄F₈, O₂, and Ar  

The Meyer Burger AK800 RIE system is for semiconductor and photovoltaic manufacturing, particularly involving processes like Reactive Ion Etching (RIE).

Overview of the AK800 RIE system

• Reactive Ion Etching (RIE): RIE is a dry etching technique that uses chemically reactive plasma to remove material from a substrate.
• Application: Meyer Burger (Germany) AG — BU MicroSystems, the division responsible for the AK800, supplied technology for the high-precision coating, structuring, and processing of surfaces. These systems were primarily used in the semiconductor and photovoltaic industries.
• Technology: The system featured a modular design, enabling it to be adapted for various surface treatment methods, including RIE, PECVD (Plasma-Enhanced Chemical Vapor Deposition), and ion beam etching/deposition.