YES Yield ENG 310-TA HMDS vacuum cure Semiconductor Wafer substrate Coating

HMDS vacuum cure / vapor prime deposition system with the highest throughput and the lowest cost of ownership.

TA series are used for HMDS coating for photoresist adhesion promotion. Systems include the 310TA (up to 200 mm wafer size, ambient up to 160 ºC)

HMDS Vacuum Cure/ Vapor Prime Systems

YES TA Series vacuum cure/vapor prime systems provide fast, uniform, cost-effective priming with hexamethyldisilizane (HMDS) to improve the adhesion of photoresist. These versatile systems also support image reversal, forming negative images with the same resolution and ease as positive resist.

Effective photoresist adhesion forms the basis for all subsequent process steps, and only a totally primed surface will accurately reproduce submicron CDs without undercutting or ragged edges. The TA systems’ vacuum cure dehydrates substrates thoroughly, enabling a superior bond with the HMDS layer that remains stable even after weeks of exposure to atmospheric moisture.

Vacuum Cure/Vapor Prime vs Wet Prime:

• Uniformity of chemical deposition

• Contact angle within ±3 degrees

• Moisture-resistant surface modification

• Increased time available between process steps

• Enhanced photoresist adhesion

• Lower chemical consumption and chemical cost than wet prime

In addition to silicon wafer processing, the TA Series can also be used for low-temperature HMDS priming of gallium arsenide, lithium niobite, and other exotic materials.

TA Series Advantages:

• N2 preheat prevents chamber cooling.

• Filtration mechanisms reduce particulate introduction.

• Surge suppression systems limit turbulence during cassette loading.

• Advanced control systems offer user-selectable temperature, process time and chamber size. • Four vacuum cycles purge O2 for safety prior to HMDS introduction