2011 Datacon 2200 evo Pick&Place machine

Complete and fully functional

Wire bonder

Longdescription: 

Drive System: Dynamic servo drives in X, Y, Z, and P axes

Vision System: Datacon image processing system for edge, structure, pattern, and ink-dot recognition

Illumination:  Independently programmable lighting systems with RGB light (partially included)

Programming Interface: Menu-driven teach-in programming via integrated ETX-based industrial PC with graphical Linux user interface (GUI)

Machine Capability:  ±10 µm @ 3σ

Substrate Camera:  CMOS camera with precision optics

Backside Camera:  Included

Wafer Camera:  Included

Force Sensor: Force-measurement sensor and Mini-BMC kit

Pickup / Stamping System: With rotary axis 0°–360°, resolution 0.0045°

Application Setup:  One application setup for pre-acceptance included

Substrate Transport System

2 x P-Part Automatic substrate transport system (main axis system)

Input / Output System

Input Buffer Substrates cannot be buffered in SMEMA mode

Output Buffer Substrates cannot be buffered in SMEMA mode

Component Feed System

Wafer Table (Without stretcher)

Wafer Lift Including wafer changer

Tool Holder and Tools

Standard Tool Holder Without shank and tip

Pick-and-Place / Adhesive Stamping Tool default version

Punching System

Single Punching System For precise die separation

Vintage: 

2011

Condition: 

very good, fully functional