Plasmatherm SLR 770 ICP Plasma Etcher

PLASMA-THERM SLR 770 Inductively Coupled Plasma Etcher

• Single Process Chamber with SLR (Shuttle Lock Transfer) Load Lock
• Manual Load with Load Lock Handling Currently Configured for 4” Wafers
• Ceramic Wafer Clamp with Helium Backside Cooling System
• Gas Distribution Box with 5ea Gas Channels
• ENI ACG-6 RF Generator: 600W @ 13.56MHz
• ENI Automatic Matching Network
• RFPP RF20M RF Generator: 2000W @ 2.0MHz
• RFPP Automatic Matching Network
• Six Zone Chamber Heater with Temperature Controller
• LEYBOLD 900 Turbo Pump with Mag 1000 Controller
• MKS ITR Ion Gauge Controller
• VAT Gate Valve with PM-5 Controller
• Mechanical Roughing Pump
• NESLAB HX-75 Chiller
• Electrical Disconnect Box - 208V, 60Hz, 3 phase

Wafer Size Range   Minimum 75 mm  Maximum 200 mm  Set Size 100 mm

Process Inductively Coupled Plasma Etching

Controller Type PC Controller Type

End Point Detection Horiba Jobin-Yvon

Loadlock   Loadlock Yes/No YES

Number of Gas Inputs Five Gas

Chillers   Number of Chillers 1  Chiller #1Manufacturer/Model Neslab HX-75