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Micro Automation M-1100

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Description

Microautomation M-1100 Wafer Dicing Saw

Maximum Substrate Diameter 6.000  in  (15.2 cm)

Spindle Type Air Bearings

Condition Excellent


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Specifications

ManufacturerMicro Automation
ModelM-1100
ConditionUsed
Stock NumberBM6279