Micro Automation M-1100
Contact us for price
or
Call +353 (0) 87 192 1110
Description
Microautomation M-1100 Wafer Dicing Saw
Maximum Substrate Diameter 6.000 in (15.2 cm)
Spindle Type Air Bearings
Condition Excellent
Specifications
| Manufacturer | Micro Automation |
| Model | M-1100 |
| Condition | Used |
| Stock Number | BM6279 |