2010 Plasmatherm 790+ RIE

Still installed and idle

Vintage is 2010

The system includes 2” and 4” platens

PLASMATHERM 790+ RIE Gas Configuration:

-CF4

-CHF3

-Ar

-O2

-N2

OEM Model Description

The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.