2016 Plasmatherm Versaline ICP Dry Etching System (2 Systems / 5 Process Chambers / 150mm)

Available for immediate sale are two Plasma-Therm Versaline Dry Etching Systems, comprising a total of five process modules.

Configuration Includes:

• System #896 — 3 Process Modules
• System #1438 — 2 Process Modules
• Wafer Size: 150 mm (6-inch)
• Source RF Generators: ENI MKS GMW25
• Included Support Equipment:
• Chillers
• Transformers
• Vacuum Pumps

Gas Configurations (Typical Chamber Setup Includes):

• CF4
• O2 (dual lines O2a / O2b)
• He
• Ar
• CHF3
• N2
• H2

Typical Mass Flow Controller Ranges Include:

• CF4 — 80/84 sccm
• O2 — 1000 sccm
• He — 50 sccm
• Ar — 50 sccm
• CHF3 — 50 sccm
• N2 — 100–200 sccm
• H2 — 100 sccm

Condition:

• Partially disassembled
• Gas and vacuum deinstalled
• Currently located in fab
• Reported partially non-operational (offered as-is, where-is)