2024 Canon FPA-5550 iZ2

i-Line Wide-Field Stepper

Lithography Equipment

Date of Manufacture: 2024-04-01

Currently Configured for: 300mm

Description:

Date of Audit7/21/2025

Original Manufacture Date2024-04

System Controller MakeINNOTECH

System Operating SystemRuby Duck

Software versionV74.45A

Wafer Size (inch)12

Wafer TypeNotch

Track/Wafer InterfaceEFEM

Track TypeRORZE

Track ModelRAE-15630

Wafer InterfaceFOUP

Auto Feeder Type IVRight

Installation TypeStand-Alone

Wafer Chuck TypeDI chuck

Wafer Chuck MaterialSilicon Carbide

Reticle Size6"

Reticle Cassette TypeCanon

Reticle ChangerCanon

Additional Reticle LibraryCanon

Power Receiving BoxInternal

Outlet Power BoxYES 

Service ToolNO

Chuck Maintenance UnitYES 

Optional Parts (RPC/EBR)NO

Lamp ManufacturerUSHIO

CE Marked?YES

CE Mark DeclarationYES

COCOM StickerEnglish

SECS/GEM CapableYES

E-Connectivity/DiagnosticNO

Date of Last PM9/17/2024

Adjustment/Check Available?YES

ATP Available?YES

System lifetime wafer count600

Lamp Age (hours)1000

System StatusOff-Line

Can Produce Wafers as-is?YES

Off-Line Date (if applicable)9/18/2024

OEM Audit Available?NO

3rd Party Audit Available?NO

Decontamination Report?NO

All cabling present?YES

Operation Manual English

Inspection SheetEnglish

Service ManualEnglish

Any Field Modifications?NO

Pellicle Particle Checker6"

Reticle Barcode ReaderCanon

Cassette Barcode Reader6"

SAC UnitNO

EMO Guard RingYES

Temperature RecorderNO

3 Phase TransformerNO

# of Signal Tower Colors3

Includes the CIS (CMOS Image Sensor) option, specific for CFA materials, which does go deeper in Wavelength to ~ 910nm, which is similar to TSA frontside alignment, but not backside alignment.