2013 BESI Datacon 2200 EVO

Wafer Sizes:

2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm, 12"/300mm

Vintage:

2013

Bonding Machine

Chip Bonder, a high-precision multi-chip bonding system in fully functional condition. This integrated dispensing system supports multiple dispensing methods and epoxy resin processing. Maximum production efficiency reaches 7,000 wafers/hour, with flip chip bonding efficiency up to 2,500 wafers/hour. X/Y-axis positioning accuracy: ±7μm; θ-axis positioning accuracy: ±0.15°. An ideal choice for semiconductor chip packaging production. Supports multiple wafer handling methods, suitable for 2-inch to 12-inch wafers. Includes original computer and keyboard with a clear, intuitive operating interface.

OEM Model Description

The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.