2010 BESI Datacon 2200 evo

Condition: “As is”  

Date of manufacture: 2010

Wafer size 200mm 

The Datacon 2200 evo high-accuracy multi-chip die bonder provides the

ultimate flexibility for die attach as well as for flip chip applications. Equipped

with integrated dispenser, 12” wafer handling, automatic tool changer, and

application specific tooling, the Datacon 2200 evo is prepared for present and

future processes and products.

Key Features

High Performance at High Accuracy

Highest accuracy ± 10 μm @ 3 Sigma (7 μm on request)

High productivity, low cost-of-ownership

Up to 4 working heads in one machine

Multi-Chip Capability

Single pass production for complex products

Die attach, flip chip, multi-chip in one machine

Epoxy writing & stamping, flux dipping

Unbeaten Flexibility

Die pick from wafer, waffle pack, gel pack, feeder

Die place to carrier, boat, substrate, PCB, lead frame, wafer

Hot and cold processes supported: epoxy, soldering, thermo-compression

MCM, SiP, Hybrids