2022 EVG 850TB

EVG 850TB:

-8" chuck configuration

-200mm

-320 degree C organic bonding

-4x loadport (attached with the main tool)

-3x Ebara Vacuum Pump

The tool is complete and is still installed

Never used or put into production

OEM Model Description

The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.

Wafer Bonder