EVG 501 Wafer Bonder

Manufacturer: EVG

Model: 501

Condition: used

Refurbishment, warranty, installation, training, service and support available

Manual wafer load substrate bonder

Capable of fusion compression bonding

Capable of thermal compression bonding

Capable of anodic bonding

Ideal for R&D and pilot production applications

High-vacuum capable bond chamber

Windows based control software and operation interface

Wafer size: up to 6”/150mm

Max Bond Force: 7 kN

Top side heater: 550°C max. in 1°C steps

Bottom side heater: 550°C max. in 1°C steps

Temperature uniformity: ± 1,5 %

Turbo pump and controller

Roughing pump

Load/unload tool

System computer, monitor, and keyboard

PDF Operations Manual for EVG 501 Bonder