KLA-Tencor Corp. SpectraShape 9000

KLA Tencor Spectrashape 9k (SS9k) LCM2 Optical CD 300mm Equipment

Critical Dimension (CD) Measurement (non SEM)

Metrology Equipment

Currently Configured for: 300mm

Asset HDD not included

SS9k Main compoments:

• Integrated console
• Inspection station
• Equipment Front End Module (EFEM)

Optics System:

• LDLS (Laser Driven Light Source)
• AMS (Alignment microscope)- is used for wafer alignment (global alignment & reference point recognition). It has two magnifications- 12Kμm and 750μm. The AMS contains its own light source and microscope. It is attached to the Optical Column and moves vertically (during focusint) by the Z Stage.
• The SS9k's optical system is capable of monitoring the shapes of three-dimensional transistors, memory cells and other key structures.
• SS9k features higher sensitivity and throughput, designed to deal with challenges at sub-20nm nodes it supports metrology targets designed for multiple-patterning lithography