2017 MEYER BURGER Diamond DW288 S4-01 Wire Saw

• OEM = Meyer Burger (MB)
• Model = Diamond Wire (DW288 S4-01)
• Type = Wire Saw (capable of SiC)
• Notes: = Comes with several spare parts (high value)
• Vintage = 2017

Spare parts list in images

1. General Description

Multi-wire diamond saw system designed for precision slicing of brittle materials such as silicon,

sapphire, and silicon carbide.

Optimized for semiconductor and photovoltaic wafer production with high yield and low kerf loss.

2. Technical Specifications

Web length: 420 mm

Max workpiece size: Ø 206–230 mm × 420 mm; square ~210 × 420 mm

Wire speed: up to 25 m/s

Wire acceleration: 8 m/s²

Minimum wire diameter: ~100 μm

Max wire tension: 45 N

Rocking angle: ±12°

Cutting fluid tank: ~240 L

Machine dimensions: 3620 × 1780 × 3010 mm

Weight: ~10,500 kg

3. Key Features

High-rigidity, temperature-stabilized frame

Advanced rocking mechanism for improved wafer quality

Touchscreen HMI with programmable recipes

Industry 4.0 integration capability

4. Applications

Silicon wafer production

Sapphire and SiC processing

Optical and semiconductor substrates

5. Process Overview

Mount ingot into fixture

Configure wire and tension

Load cutting recipe

Execute slicing with fluid cooling

Collect wafers and proceed to post-processing

6. Installation Requirements

Reinforced industrial floor

Cooling and fluid management system

Electrical supply conversion if required

Coltrolled environment recommended

7. Maintenance

Diamond wire replacement

Fluid and filtration system upkeep

Periodic calibration of mehcanical systems