2013 CyberOptics SE-500-X

The system is in used/good/known working condition and removed from the fab and in storage

CyberOptics SE-500-X, a high-speed inline 3D solder paste inspection system designed for demanding SMT production environments. This system is used immediately after the solder paste printing process to inspect solder deposits before component placement, helping manufacturers catch print-related defects early and maintain consistent process quality.

The SE-500-X performs 100% 3D solder paste inspection, measuring critical solder paste characteristics such as height, area, and volume. It is well suited for high-mix and high-throughput electronics manufacturing, with the ability to inspect fine-pitch applications, small pad sizes, and larger PCB panel formats. Its large-board capability makes it especially valuable for manufacturers running complex assemblies or oversized panels that require reliable, repeatable inspection.

By identifying insufficient paste, excess paste, bridging, misalignment, and other print defects before the board moves further down the line, the SE-500-X helps reduce rework, scrap, and downstream quality issues. The system also supports process control through SPC tracking, alarm capability, barcode reading, automatic conveyor width adjustment, and closed-loop feedback capabilities that can help improve printer performance and overall first-pass yield.

For manufacturers looking to improve solder paste quality, stabilize their SMT process, and reduce costly defects, the CyberOptics SE500-X provides a proven inspection platform with strong measurement accuracy, production speed, and process-control functionality