2014 Disco DFL7160 DAF

Disco

DFL7160 Laser saw (DAF type)

The DISCO DFL 7160 is a fully automatic laser saw used in the semiconductor industry to dice and cut wafers. The "DAF type" means it is specially configured to process wafers using DAF (Dicing Die Attach Film) technology, a material used to attach chips in stacked packaging configurations. [1, 2, 3]